This ninth edition covers both analytical and empirical approaches to the subject. The examples and templates provide students with resources for computer-numerical solutions.

    Requiring only basic algebra and trigonometry, the new edition is notable for its readability, learning features and numerous full-color photos and illustrations. A systems approach is used to cover state-of-the-art communications technologies, to best reflect current industry practice. This edition contains greatly expanded and updated material on the Internet, cell phones, and wireless technologies. Practical skills like testing and troubleshooting are integrated throughout. A brand-new Laboratory & Activities Manual provides both hands-on experiments and a variety of other activities, reflecting the variety of skills now needed by technicians. A new Online Learning Center web site is available, with a wealth of learning resources for students. An Instructor Productivity Center CD-ROM features solutions to all problems, PowerPoint lessons, and ExamView test banks for each chapter.

    They are converted to metric units using realistic data to help students grasp what is feasible in engineering practice.

    Noted for its crystal clear presentation and easy-to-follow problem solving methodology, Incropera and Dewitt's systematic approach to the first law develops reader confidence in using this essential tool for thermal analysis. Readers will learn the meaning of the terminology and physical principles of heat transfer as well as how to use requisite inputs for computing heat transfer rates and/or material temperatures.

    An illustration program supports the concepts and theories discussed.

    New to this third edition are expanded coverage of such important topics as surface boundary interfaces, improved discussions of such physical and mathematical laws as the Law of Biot and Savart and the Euler Momentum Integral. A very important new section on Computational Fluid Dynamics has been added for the very first time to this edition. Expanded and improved end-of-chapter problems will facilitate the teaching experience for students and instrutors alike. This book remains one of the most comprehensive and useful texts on fluid mechanics available today, with applications going from engineering to geophysics, and beyond to biology and general science. * Ample, useful end-of-chapter problems.* Excellent Coverage of Computational Fluid Dynamics.* Coverage of Turbulent Flows.* Solutions Manual available.

    

    Digital Integrated Circuits maintains a consistent, logical flow of subject matter throughout. KEY TOPICS: Addresses today's most significant and compelling industry topics, including: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective. MARKET: For readers interested in digital circuit design.

    It gives clear descriptions of linear systems and uses mathematics not only to prove axiomatic theory, but also to enhance physical and intuitive understanding.

    An exceptional book written by a true professional.

    It covers such areas as biotechnology and biomedical engineering.

    

    This book also features the design process, streamlined coverage of statistics, an overview of materials and materials selection, failure and fatigue, and review of basic strength of materials topics.

    It follows a more quantitative and design-oriented approach than other texts in the market, helping readers gain a better understanding of important concepts. They'll also discover how material properties relate to the process variables in a given process as well as how to perform manufacturing science and quantitative engineering analysis of manufacturing processes.

    The new edition from Chopra includes many topics encompassing the theory of structural dynamics and the application of this theory regarding earthquake analysis, response, and design of structures. No prior knowledge of structural dynamics is assumed and the manner of presentation is sufficiently detailed and integrated, to make the book suitable for self-study by students and professional engineers.